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SESEI 3 Newsletter, Europe Issue 04, April 2017

We are pleased to present our fourth edition of EU Project SESEI Phase 3 Newsletter-Europe covering important news, updates and information from India.
As you may be aware, India was very much in news due to currency demonitisation by the government, which created quite a furor, however it has resulted in boosting the digitization of financial transactions and uptake of Mobile payment/e-payments.
Reading across the newsletter, you will observe that the financial budget “2017-18” has introduced a levy of additional 2% on PCBs import which will further increase the final price of the smartphones. In other words handset manufacturers [domestic or foreign] will have to pay extra duty of 2% if they import printed circuit boards (PCB) for their usage in mobile phones.

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